<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE article PUBLIC "-//NLM//DTD JATS (Z39.96) Journal Publishing DTD v1.3 20210610//EN" "JATS-journalpublishing1-3.dtd">
<article article-type="research-article" dtd-version="1.3" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xml:lang="ru"><front><journal-meta><journal-id journal-id-type="publisher-id">zhps</journal-id><journal-title-group><journal-title xml:lang="ru">Журнал прикладной спектроскопии</journal-title><trans-title-group xml:lang="en"><trans-title>Zhurnal Prikladnoii Spektroskopii</trans-title></trans-title-group></journal-title-group><issn pub-type="ppub">0514-7506</issn><publisher><publisher-name>B. I. Stepanov Institute of Physics of the National Academy of Sciences</publisher-name></publisher></journal-meta><article-meta><article-id custom-type="elpub" pub-id-type="custom">zhps-1764</article-id><article-categories><subj-group subj-group-type="heading"><subject>Research Article</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="ru"><subject>ПРИБОРЫ И МЕТОДЫ СПЕКТРОСКОПИИ</subject></subj-group><subj-group subj-group-type="section-heading" xml:lang="en"><subject>DEVICES AND METHODS OF SPECTROSCOPY</subject></subj-group></article-categories><title-group><article-title>Определение температуры и теплового сопротивления мощных лазерных AlInGaN-диодов методом релаксации прямого напряжения</article-title><trans-title-group xml:lang="en"><trans-title>DETERMINATION OF TEMPERATURE AND THERMAL RESISTANCE OF HIGH-POWER AlInGaN LASER DIODES BY FORWARD VOLTAGE RELAXATION METHOD</trans-title></trans-title-group></title-group><contrib-group><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Аладов</surname><given-names>А. В.</given-names></name><name name-style="western" xml:lang="en"><surname>Aladov</surname><given-names>A. V.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Санкт-Петербург</p></bio><bio xml:lang="en"><p>St. Petersburg</p></bio><email xlink:type="simple">aaladov@mail.ioffe.ru</email><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Закгейм</surname><given-names>А. Л.</given-names></name><name name-style="western" xml:lang="en"><surname>Zakgeim</surname><given-names>A. L.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Санкт-Петербург</p></bio><bio xml:lang="en"><p>St. Petersburg</p></bio><xref ref-type="aff" rid="aff-1"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Иванов</surname><given-names>А. Е.</given-names></name><name name-style="western" xml:lang="en"><surname>Ivanov</surname><given-names>A. E.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Санкт-Петербург</p></bio><bio xml:lang="en"><p>St. Petersburg</p></bio><xref ref-type="aff" rid="aff-2"/></contrib><contrib contrib-type="author" corresp="yes"><name-alternatives><name name-style="eastern" xml:lang="ru"><surname>Черняков</surname><given-names>А. Е.</given-names></name><name name-style="western" xml:lang="en"><surname>Chernyakov</surname><given-names>A. E.</given-names></name></name-alternatives><bio xml:lang="ru"><p>Санкт-Петербург</p></bio><bio xml:lang="en"><p>St. Petersburg</p></bio><xref ref-type="aff" rid="aff-1"/></contrib></contrib-group><aff-alternatives id="aff-1"><aff xml:lang="ru"><institution>НТЦ микроэлектроники РАН</institution></aff><aff xml:lang="en"><institution>Scientific and Technical Center of Microelectronics RAS</institution></aff></aff-alternatives><aff-alternatives id="aff-2"><aff xml:lang="ru"><institution>НТЦ микроэлектроники РАН;&#13;
Физико-технический институт им. А. Ф. Иоффе РАН</institution></aff><aff xml:lang="en"><institution>Scientific and Technical Center of Microelectronics RAS;&#13;
Ioffe Physical-Technical Institute RAS</institution></aff></aff-alternatives><pub-date pub-type="collection"><year>2025</year></pub-date><pub-date pub-type="epub"><day>07</day><month>02</month><year>2025</year></pub-date><volume>92</volume><issue>1</issue><fpage>120</fpage><lpage>125</lpage><permissions><copyright-statement>Copyright &amp;#x00A9; Аладов А.В., Закгейм А.Л., Иванов А.Е., Черняков А.Е., 2025</copyright-statement><copyright-year>2025</copyright-year><copyright-holder xml:lang="ru">Аладов А.В., Закгейм А.Л., Иванов А.Е., Черняков А.Е.</copyright-holder><copyright-holder xml:lang="en">Aladov A.V., Zakgeim A.L., Ivanov A.E., Chernyakov A.E.</copyright-holder><license xml:lang="ru" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>Данная работа распространяется под лицензией Creative Commons Attribution 4.0.</license-p></license><license xml:lang="en" license-type="creative-commons-attribution" xlink:href="https://creativecommons.org/licenses/by/4.0/" xlink:type="simple"><license-p>This work is licensed under a Creative Commons Attribution 4.0 License.</license-p></license></permissions><self-uri xlink:href="https://zhps.ejournal.by/jour/article/view/1764">https://zhps.ejournal.by/jour/article/view/1764</self-uri><abstract><p>Предложен усовершенствованный метод определения температуры лазерного диода и теплового сопротивления основных элементов эквивалентной тепловой цепи, базирующийся на измерении переходной термочувствительной характеристики — прямого напряжения на p-n-переходе в ответ на скачкообразное воздействие греющего токового импульса. Экспериментально исследованы и проанализированы отдельные составляющие и общее тепловое сопротивления лазерного диода. Установлено, что основной вклад в общее тепловое сопротивление, которое составило ~7.4 К/Вт, вносят собственно слой лазерного кристалла от p-n-перехода до нижней плоскости (~2.8 К/Вт) и AlN-коммутационная теплопроводящая подложка (~2.6 К/Вт), для которых не просматриваются пути дальнейшего снижения. Показано, что без значительного перегрева ΔT &lt; 40 К реализуется непрерывный режим работы с шестикратным превышением порога до I ≈ 2 A и мощностью генерации P ≈ 2.5 Вт, КПД ≈ 30 % и дифференциальным квантовым выходом η ≈ 60 %. </p></abstract><trans-abstract xml:lang="en"><p>An improved method for determining the temperature of a laser diode and the thermal resistance of the main elements of an equivalent thermal circuit based on measuring transient temperature-sensitive characteristics of direct voltage at the p-n junction in response to a step-like effect of a heating current pulse is proposed. The individual components and the total thermal resistance of the laser diode were experimentally studied and analyzed, the latter was ~7.4 K/W. It was found that the main contribution to the total thermal resistance is made by the laser crystal layer itself from the p-n junction to the lower plane (~2.8 K/W) and the AlN-switching thermal conductive substrate (~2.6 K/W), for which no further reduction paths are visible. At the same time, it was shown that without significant overheating ΔT &lt; 40 K, a continuous mode of operation is realized with 6 times exceeding the threshold I ≈ 2 A and generation power P ≈ 2.5 W, efficiency ~30 % and differential quantum output η ≈ 60 %. </p></trans-abstract><kwd-group xml:lang="ru"><kwd>лазерный диод</kwd><kwd>p-n-переход</kwd><kwd>температура лазера</kwd><kwd>тепловое сопротивление лазера</kwd><kwd>термочувствительный параметр</kwd><kwd>структурные функции</kwd><kwd>оптическая мощность</kwd><kwd>КПД</kwd></kwd-group><kwd-group xml:lang="en"><kwd>laser diode</kwd><kwd>p-n junction</kwd><kwd>temperature of laser</kwd><kwd>thermal resistance of laser</kwd><kwd>temperaturesensitive parameter</kwd><kwd>structural functions</kwd><kwd>optical power</kwd><kwd>efficiency</kwd></kwd-group></article-meta></front><back><ref-list><title>References</title><ref id="cit1"><label>1</label><citation-alternatives><mixed-citation xml:lang="ru">Zh. Zhong, Sh. Lu, J. Li, W. Lin, K. 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