Super Sub-Nyquist Single-Pixel Terahertz Imaging Using Hadamard Basis
Abstract
We present a super sub-Nyquist Hadamard single-pixel THz imaging system in which the THz waves are modulated by a digital micromirror device and a laser driver. Spatial coding of the THz radiation is performed using the cake-cutting (CC)-order Hadamard basis. THz images are reconstructed from a series of coding sequences of the measurement intensity. We prove that with the use of super sub-Nyquist sampling, single-pixel THz imaging with 87% fidelity and a signal-to-noise ratio of more than 23 dB can be achieved using 10% of the CC-order Hadamard basis patterns. The total variation regularization algorithm is shown to have higher robustness to noise than the Hadamard transform and thus offers a good technical solution for single-pixel THz imaging.
About the Authors
J. GuoChina
Mianyang
Q. Ch. Liu
China
Mianyang, Chengdu
H. Deng
China
Mianyang, Chengdu
G. L. Li
China
Mianyang, Chengdu
L. P. Shang
China
Mianyang, Chengdu
References
1. P. Hillger, J. Grzyb, R. Jain, U. R. Pfeiffer, IEEE THz Sci. Tech., 9, No. 1, 1–19 (2019).
2. Q. Wang, L. Xie, Y. Ying, Appl. Spectrosc. Rev., 57, No. 3, 249–264 (2021).
3. C. Jansen, S. Wietzke, O. Peters, M. Scheller, N. Vieweg, M. Salhi, N. Krumbholz, C. Joerdens, T. Hochrein, M. Koch, Appl. Optics, 49, No. 19, E48–E57 (2010).
4. S. C. Zhong, Front Mech. Eng., 14, No. 3, 273–281 (2019).
5. M. Danciu, T. Alexa-Stratulat, C. Stefanescu, G. Dodi, B. I. Tamba, C. T. Mihai, G. D. Stanciu, A. Luca, I. A. Spiridon, L. B. Ungureanu, V. Ianole, I. Ciortescu, C. Mihai, G. Stefanescu, I. Chirila, R. Ciobanu, V. L. Drug, Mater., 12, No. 9, 16 (2019).
6. X. Yang, X. Zhao, K. Yang, Y. P. Liu, Y. Liu, W. L. Fu, Y. Luo, Trends Biotechnol., 34, No. 10, 810–824 (2016).
7. J. Dong, A. Locquet, M. Melis, D. S. Citrin, Sci. Rep., 7 (2017).
8. E. Abraham, A. Younus, J. C. Delagnes, P. Mounaix, Appl. Phys. A, 100, No. 3, 585–590 (2010).
9. E. J. Candes, J. Romberg, T. Tao, IEEE Inform. Theory, 52, No. 2, 489–509 (2006).
10. E. J. Candes, T. Tao, IEEE Inform. Theory, 52, No. 12, 5406–5425 (2006).
11. D. L. Donoho, IEEE Inform. Theory, 52, No. 4, 1289–1306 (2006).
12. H. Shapiro, J. I. Jeffrey, Phys. Rev. A, 78, No. 6, 061802 (2008).
13. N. Gopalsami, S. Liao, T. W. Elmer, E. R. Koehl, A. Heifetz, A. C. Raptis, L. Spinoulas, A. K. Katsaggelos, Opt Eng., 51, No. 9, 091614(1–5) (2012).
14. S. Busch, B. Scherger, M. Scheller, M. Koch, Opt. Lett., 37, No. 8, 1391–1393 (2012).
15. M. I. B. Shams, L. Liu, S. Rahman, L. J. Cheng, P. Fay, Z. Jiang, J. Qayyum, H. G. Xing, Electron Lett., 50, No. 11, 801–803 (2014).
16. S. Augustin, J. Hieronymus, P. Jung, H. W. Hübers, J. Infrared Millim., 36, No. 5, 496–512 (2015).
17. R. I. Stantchev, B. Sun, S. M. Hornett, P. A. Hobson, G. M. Gibson, M. J. Padgett, E. Hendry, Sci. Adv., 2, No. 6 (2016).
18. R. I. Stantchev, D. B. Phillips, P. Hobson, S. M. Hornett, M. J. Padgett, E. Hendry, Optica, 4, No. 8, 989–996 (2017).
19. Y. Lu, X.-K. Wang, W.-F. Sun, S.-F. Feng, J.-S. Ye, P. Han, Y. Zhang, IEEE THz Sci. Tech., 10, No. 5, 495–501 (2020).
20. L. Zanotto, R. Piccoli, J. Dong, D. Caraffini, R. Morandotti, L. Razzari, Opt. Express, 28, No. 3, 3795–3802 (2020).
21. T. A. Lu, Z. Qiu, Z. Zhang, J. Zhong, Opt. Laser Eng., 134 (2020).
22. P. G. Vaz, D. Amaral, L. F. Requicha Ferreira, M. Morgado, J. Cardoso, Opt. Express, 28, No. 8, 11666–11681 (2020).
23. M. J. Sun, L. T. Meng, M. P. Edgar, M. J. Padgett, N. Radwell, Sci. Rep., 7, No. 1, 3464 (2017).
24. W. K. Yu, Sensors (Basel), 19, No. 19, 4122 (2019).
25. X. Yu, R. I. Stantchev, F. Yang, E. Pickwell-MacPherson, Sci. Rep., 10, No. 1, 9338 (2020).
26. L. Lopez-Garcia, W. Cruz-Santos, A. Garcia-Arellano, P. Filio-Aguilar, J. A. Cisneros-Martinez, R. Ramos-Garcia, Opt. Express, 30, No. 8, 13714–13732 (2022).
27. M.-F. Li, L. Yan, R. Yang, Y.-X. Liu, Acta Phys. Sin., 68, No. 6, 064202 (2019).
Review
For citations:
Guo J., Liu Q.Ch., Deng H., Li G.L., Shang L.P. Super Sub-Nyquist Single-Pixel Terahertz Imaging Using Hadamard Basis. Zhurnal Prikladnoii Spektroskopii. 2023;90(5):811.